The MediaTek Dimensity 9000 SoC is the newest flagship processor to contend with Qualcomm’s top-tier Snapdragon chipset. This is the first smartphone chipset made on TSMC’s 4nm technology, and it’s the first to adopt Arm’s latest version 9 design. The MediaTek Dimensity 9000 SoC includes a ten-core Arm Mali-G710 GPU and six fifth-generation APU cores for AI computation. The new flagship SoC also includes a new 18-bit Imagiq Gen 7 ISP, which promises to be the first to capture a 320-megapixel image in the world. It also has Wi-Fi 6E and Bluetooth v5.3 compatibility.
The first smartphones powered by the MediaTek DImensity 9000 SoC are expected to debut in late Q1 2022, according to the company. The chipset features one Arm Cortex-X2 processor running at 3.05GHz, three Arm Cortex-A710 processors running at up to 2.85GHz, and four Arm Cortex-A510 processors. LPDDR5x 7500Mbps is also supported by the chipset.
As previously stated, the MediaTek Dimensity 9000 SoC features a flagship 18-bit HDR-ISP design that allows for simultaneous HDR video capture from three cameras. It also adds support for smartphones with 320-megapixel cameras. When comparison to the prior generation, the new six-core fifth-generation AI processing unit is expected to provide a 4x power efficiency boost.
The ARM Mali-G710 graphics processor is included in the MediaTek Dimensity 9000 SoC. The chipset boasts an industry-first Vulkan raytracing SDK for Android. It will also support full-HD+ displays with a refresh rate of 180Hz. The Dimensity 9000 includes the world’s first 5G smartphone modem based on the 3GPP Release-16 standard. It includes an integrated 5G modem with downlink speeds of up to 7Gbps, 3CC Carriers Aggregation (300MHz), and uplink speeds of up to 300 percent faster.
Bluetooth 5.3, Wi-Fi 6E 22, Wireless Stereo Audio, and Beidou III-B1 C GNSS capabilities are all available with the MediaTek Dimensity 9000 SoC.