Saturday, October 23, 2021
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Next year’s iPhone 14 could be the first smartphone to use TSMC’s new packaging platform


Next year's iPhone 14 could be the first smartphone to use TSMC's new packaging platform

According to Patently Apple, TSMC is working on a new packaging platform called 3DFabric. During the summer, the foundry’s CEO, C.C. Wei, said, “We are working with several customers on 3DFabric to enable chiplet architecture.” The world’s largest independent foundry now says that its first customers employing the new 3DFabric technology will include Apple, AMD, MediaTek, Xilinx, NXP, and Qualcomm.

TSMC’s new 3DFabric Packaging platform could debut on iPhone 14

With 3DFabric technology, TSMC’s customers can use chiplets which are smaller chips that are used to create a larger Integrated Circuit. This technology can quicken the time-to-market for new technology since this platform allows customers to keep reusing parts of the component that do not change. And according to TSMC, “3DFabric allows the integration of high density interconnected chips into a packaged module delivering improved bandwidth, latency, and power efficiency.”
TSMC will launch the 3DFabric Packaging platform once it starts shipping 3nm chips. TSMC was supposed to be manufacturing the Apple A16 Bionic chipset using the 3nm process node. But last month the company announced a delay due to the complexities of building a chip at this process node and the A16 Bionic will reportedly be made using the 4nm process node instead.

As a result, it isn’t clear whether we will see the 3DFabric Packaging platform used in the iPhone 14 although Patently Apple’s report says that “Apple’s next-gen iPhones in 2022 are likely to use TSMC’s 3D Fabric platform.” The report goes on to add that with the platform, many AI functions, new memory types, and embedded chips will be combined. TSMC is expected to test the platform this year at its facilities in Zhunan and Nanke with mass production scheduled for the second half of 2022.

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TSMC’s new packaging platform takes a modular, Lego-like approach using chiplets

If this sounds like some kind of modular solution to packaging, it is. In a video that TSMC produced to show off the new platform, kids are playing with Lego blocks which is the ultimate modular toy. Liao Dedui, deputy general manager of TSMC’s advanced packaging technology and services, says that the 3DFabric brings together advanced packaging and testing technologies.

TSMC’s blog discusses back-end technologies such as Chip-on-Wafer (CoW) and Wafer-on-Wafer (WoW) die stacking. These allow for the 3D stacking of both similar and dissimilar dies which can be used to provide more computing power by increasing the number of computer cores. It also provides more memory and higher bandwidth thanks to stacked memory, and will also improve power delivery.



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