TSMC’s new 3DFabric Packaging platform could debut on iPhone 14
As a result, it isn’t clear whether we will see the 3DFabric Packaging platform used in the iPhone 14 although Patently Apple’s report says that “Apple’s next-gen iPhones in 2022 are likely to use TSMC’s 3D Fabric platform.” The report goes on to add that with the platform, many AI functions, new memory types, and embedded chips will be combined. TSMC is expected to test the platform this year at its facilities in Zhunan and Nanke with mass production scheduled for the second half of 2022.
TSMC’s new packaging platform takes a modular, Lego-like approach using chiplets
If this sounds like some kind of modular solution to packaging, it is. In a video that TSMC produced to show off the new platform, kids are playing with Lego blocks which is the ultimate modular toy. Liao Dedui, deputy general manager of TSMC’s advanced packaging technology and services, says that the 3DFabric brings together advanced packaging and testing technologies.